QUALITY INSPECTION EQUIPMENT

1. PROFILE PROJECTOR MACHINE

CORE APPLICATIONS

• Incoming Quality Control (IQC): Measures the dimensions of incoming materials and components.
• High-Precision Measurement: Accurately measures dimensions down to the micrometer (µm) level.
• 2D/3D Dimensional Measurement: Performs both two-dimensional and three-dimensional measurements of materials.

• Measurement Accuracy: ≤ (3 + L/200) µm
• Magnification Range: 30–190X
• Display Resolution: 0.001 mm
• Image Processing System: 1/2ʺ TEO CCD Color Camera
• Lens Magnification: 0.7X–4.5X (Working Distance: 92 mm)

2. AUTOMATED OPTICAL INSPECTION (AOI)

• Post-Reflow Quality Inspection: Specifically designed for inspection after the reflow soldering process, enabling immediate detection of PCB defects and deformation.
• High-Speed Mass Production: Ideal for large-scale electronic component manufacturing lines requiring maximum inspection accuracy.

• Advanced RGBW 4-Color Lighting: Optimizes image contrast to accurately detect insufficient solder, poor solder joints, and other assembly defects.
• Intelligent Dual-Lane Conveyor: Simultaneously inspects two different PCB types from two independent production lines, maximizing equipment utilization.
• User-Friendly Programming with High Stability: Multi-color imaging technology enables rapid program creation, minimizes false calls, and ensures long-term stable operation.

3. X-RAY INSPECTION MACHINE

• Inspection of Hidden Components: Ideal for inspecting BGA, CSP, LED, Flip Chip, semiconductor devices, and complex electronic modules.
• Multi-Industry Applications: Detects defects in batteries, photovoltaic components, and precision metal castings.

• 2MP High-Resolution Imaging: Equipped with a high-contrast CCD camera to clearly display internal solder joint structures.
• Flexible 3D Inspection Angle: Smooth X/Y/Z axis movement combined with a 60° tilt eliminates blind inspection areas.
• Large Inspection Area & 300X Magnification: Inspection area up to 510 × 460 mm, suitable for large PCB assemblies.
• Automatic Scan Programming: Automatically generates X/Y scanning paths to improve inspection efficiency for high-volume production.
• Intelligent Measurement & Reporting: Automatically analyzes defect dimensions and instantly generates inspection reports.

4. RoHS TESTER (XRF)

• RoHS Compliance Testing: Rapidly analyzes and screens hazardous substances in various materials, including plastics, aluminum, metals, and solder.
• Supply Chain Quality Assurance: Helps manufacturers certify products for export to highly regulated markets such as the European Union.

• Complete RoHS 6/6 Analysis: Accurately detects all six restricted hazardous substances under the RoHS Directive (Lead, Mercury, Cadmium, Hexavalent Chromium, PBB, and PBDE).
• Complex Coating Thickness Measurement: Performs advanced analysis of single and multi-layer plating/coating structures.
• High-Speed Analysis: Provides fast and highly accurate testing results, reducing sample screening time.
• Automatic Report Generation: Exports professional inspection reports directly to Excel and PDF formats.
• Energy Efficient: Low operating power consumption of only 275 W/h for reliable continuous operation.