Manufacturing Process Capabilities
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IPC J-STD-001F, IPC-A-610F
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ISO 9001 - ISO 14001
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Materials IQC (Sampling Plan)
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Using lead SnPb và RoHS
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Complies to RoSH 2011/65/EU std
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Extra Large Board (460x510mm)
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Silkscreen solder paste
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SMT Micro BGA, CSP 01x005 size chips
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X-Ray, AOI and Digital Microscope
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High Melting Point(HMP) soldering process up to 400oC
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Complies with Ratio Frequency (RF) STD, Isolations Circult, High Filters, Signal Sources, Robust Lead Circulator, SMT board, PCB multilayer, tools electronic education.
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Complies with ESD/Cleaning room ANSI-ESD-S20-20
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Humidity control by J-STD-033C
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Support CAD and Solid works, CAM, PLC
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