SMT ASSEMBLY/THROUGH-HOLE

Driven by our motto "No MOQ – Quickly Prototyping", we satisfy all customer demands, from R&D trial runs to mass production

SMT ASSEMBLY

  •  Micro-component Handling Capabilities:Supporting standard chip sizes starting from 0201, 0402, 0603... up to larger configurations.
  • Complex IC Package Reflow Soldering:BGA, QFN, QFP, SOIC, etc.
  • SMD Connector:High-precision assembly and alignment of surface-mount connectors.
  • Rigorous Quality Control:100% inspection AOI systems and high-magnification microscopes.
  • X-ray Inspection:X-ray analysis of BGA solder joints to safeguard against short circuits and voids.
  • Flexible SMT System:Capable of handling the PCB populated with up to 200 component types and processing approximately 2,000 solder placement points per board.

THROUGH-HOLE COMPONENT ASSEMBLY
In addition to SMT, we maintain a dedicated workflow for the completion of through-hole components, heavy-duty power electronics, and various connector types:
  •    Manual Soldering:Tailored for specialized board layouts or prototyping phases.
  •    Wave Soldering:Standardized through-hole soldering utilizing automated wave soldering machine, ensuring uniform, bright, and robust solder joints for high-volume orders.

 
BOX BUILD
  • Mechanical Assembly:Enclosing printed circuit boards into box (plastic housings, metal chassis).
  • System Wiring & Harnessing:Routing internal cable assemblies, wire harnesses, switches, displays, and power supplies.
  • Final Product Packaging:Integrating components into a completely finished electronic product, ready for end-user deployment or system integration.