PCB/Mechanical Assembly


 Manufacturing Process Capabilities

  • IPC J-STD-001F, IPC-A-610F 
  • ISO 9001 - ISO 14001
  • Materials IQC (Sampling Plan)
  • Using lead SnPb và RoHS
  • Complies to RoSH 2011/65/EU std
  • Extra Large Board (460x510mm)
  • Silkscreen solder paste
  • SMT Micro BGA, CSP 01x005 size chips
  • X-Ray, AOI and Digital Microscope
  • High Melting Point(HMP) soldering process up to 400oC
  • Complies with Ratio Frequency (RF) STD, Isolations Circult, High Filters, Signal Sources, Robust Lead Circulator, SMT board, PCB multilayer, tools electronic education.
  • Complies with ESD/Cleaning room ANSI-ESD-S20-20
  • Humidity control by J-STD-033C
  • Support CAD and Solid works, CAM, PLC